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Intelligent Security Industry

Application of Thermal Conductive Interface Materials in Security Industry

Introduction to the Concept, Principle and Way of Heat Dissipation uuuuuuuuuu

Introduction to Classification of Security Equipment

Security Camera-Host Structure Analysis

Analysis of Heat Dissipation Structure of Security Camera-Host

Security Camera-Temperature Rise Diagram of Host

Selection of Thermal Conductive Interface Materials: Thermal Conductive Silica Gasket/Thermal Conductive Silica Grease

Future Development Direction of Security Industry

Cooperative vendors uuuuuuuuuuuu

Concluding remarks

Introduce the principle of heat dissipation and the way of heat dissipation.

Integrated circuits are widely used in electronic products. It is well known that high temperature is the enemy of integrated circuits. High temperature will not only lead to instability of equipment operation, shorten service life, but also may burn some parts. Portable equipment will also cause harm to human body. The heat that causes high temperature does not come from outside the electronic equipment, but from inside the electronic equipment, or inside the integrated circuit. The function of heat dissipation components is to absorb and disperse these heat into or out of the equipment to ensure the normal temperature of electronic components.

Heat dissipation can be divided into passive heat dissipation and active heat dissipation.

Active heat dissipation: through external force to promote fluid circulation, take away heat.

Passive heat dissipation: It is based on the principle of thermal expansion and contraction in physics, natural circulation heat dissipation of fluid or absorption of heat by specific heat capacity of solid fluid to achieve the purpose of heat dissipation.

The heat dissipation modes of thermal conductive interface materials can be subdivided into heat conduction, heat convection and heat radiation.

Heat conduction: (thermal conduction)

It is a phenomenon that heat transfers from one part of the system to another or from one system to another without macroscopic motion in the medium. It can occur in solids, liquids and gases.

Thermal convection

It refers to the heat transfer process caused by the relative displacement (convection) between different parts of the fluid caused by the macroscopic movement of the fluid, and the mixing of cold and hot fluids. The convective heat transfer can be divided into forced convection and natural convection. Forced convection is a fluid circulation driven by external forces. Natural convection is due to the change of temperature gradient with different density. Gravity causes low temperature and high density fluids to flow from top to bottom and high temperature and low density fluids to flow from bottom to top.

Thermal radiation

It is a kind of heat transfer mode in which an object emits heat energy outward in the form of electromagnetic radiation. It does not depend on any external conditions.

Thermal conductivity

Thermal conductivity is the thermal conductivity coefficient, which refers to the heat transfer through a square metre area in one second (1S) of a material with a thickness of 1m under stable heat transfer conditions. The difference of temperature between the two surfaces is 1 degree (K, C). The unit of heat transfer is W/(m K), where K can be replaced by C.