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Mobile Electronics Industry

Outline of the plan

3C is the abbreviation of three kinds of electronic products: computer, communication and consumer electronics. Nowadays, many IT industries have marched into the 3C field one after another. Taking the 3C integration technology products as the breakthrough point of development, it has become a new bright spot in the IT industry. Rich 3C electronic products play a variety of roles in people's daily life, providing information, facilitating, and even inspiring everyone's creativity. In product development, lighter, thinner and more portable is the goal of designers. Therefore, the product design process will inevitably encounter more and more EMI and heat dissipation problems. As a domestic influencer in these two aspects, Hongfucheng, based on more than ten years of exploration and innovation in the 3C industry, wholeheartedly provides solutions to customers.

Classical case CLASSIC CASE

Case Study of Thermal Conductive Silicone Gasket

Compared with traditional desktop computers, notebook computers have the advantages and characteristics of being light and thin. Because of the narrow space inside the notebook body and the concentration of high-calorific components, they bring great pressure to heat dissipation. Usually, designers can achieve heat dissipation through the combination of heat pipes and cooling ducts. However, how to transfer the heat generated by components to heat pipes is very critical, providing thermal conductive silica gel. The combination of gasket and phase change can solve the problem of heat transfer from heating elements to heat pipes by using phase change materials as interface materials for high-calorific components such as main chips and GPUs, and heat conduction gaskets as thermal interface materials for other low-calorific components, so that heat can be convected uniformly and rapidly through air ducts to achieve the purpose of heat dissipation.

Case Study of Thermal Conduction and Fat Coagulation

As the integration of components is getting higher and higher, heating components with different heights are usually on the same motherboard. If a whole gasket is used, the pressure of each component will be different and some components or chassis will be destroyed when assembled. Therefore, only one heat conduction pad can be mounted on each electronic component to achieve good heat conduction in complex thermal environment. According to the particularity of such devices, a low stress-strain interface material suitable for dispensing operation is developed. This material can dispensing operation and improve operability. At the same time, the low stress-strain performance is suitable for the thermal conductivity requirements of components with different heights at the same interface, and the product itself has good fluidity and good interface. The compatibility and thermal resistance are very low, which can solve the heat conduction problem of this kind of device very well.